Coating and resin bonding in electronics
April 2023
Electronic products can be subjected to severe mechanical, thermal, hygrometric and environmental stress. These stresses can degrade and shorten the lifespan of devices.
Potting operations are the most commonly used in the electronics industry, and meet the requirements described below.
Waterproofing
Thanks to the flexibility of the resins used, water and dust-tight seals can be made on housings and connectors.
This technique is perfectly suited to small and medium production runs, as well as prototypes.
Vibrations
Electronic boards, especially those with large components, are sensitive to vibration. Encapsulating the board and its components stiffens the whole, as well as the soldered or connected wiring, significantly increasing MTBF (Mean Time Before Failure).
This operation also protects the electronic circuit from a corrosive environment.
Intellectual property
Completely encapsulating an electronic board with a two-component resin makes it virtually impossible to access the printed circuit board and its components, making it more difficult to copy the electronic board.
Gigatec is equipped with a coating machine for all these processes. Please do not hesitate to contact us.